Epoxy hot curing

 

code short description

mixture 

viscosity

[mPa.s TA]

shelf life

[days 23°C]

curing

[hours]

flexural

modulus

[MPa]

Tg

[°C]

tech

data

EP506_H24 Long potlife, good adhesion to wood, metal, glass; high temperature resistance. Recommended for filament windings, printed circuit boards, adhesives, laminates 11900 0.4

2@80°C

+4@150°C

2540 158


EP506_H38 Medium temperature curing, long shelf life of the mixture. The polymer is characterized by high mechanical properties and thermal resistance. Designed for applications prepreg with excellent wetting of glass and carbon fibers. 19800 90 2@125°C 3240 138


EP506_H40 Low viscosity and long shelf life, rapid polymerization at elevated temperatures. The polymer exhibits good mechanical properties and thermal resistance. 800 90

2@120°C

+2@150°C

2960 122

EP6004 1KHC

One-component epoxy system characterized by low viscosity and shelf life greater than three months, medium temperature curing. The polymer shows a high resistance to thermal cycles and high dielectric properties. Particularly suitable for impregnation of electrical windings such motors, coils, transformers; coatings in general and component encapsulations.

420 >90  2@130°C   2800 56